Display device and inter-substrate conducting structure

ABSTRACT

According to one embodiment, a display device includes a first substrate including a first basement and a first terminal, a second substrate opposing the first substrate and including a second basement and a second terminal, an organic insulating layer located between the first basement and the second basement, a first hole penetrating the second basement and the organic insulating layer, a second hole penetrating at least one of the second basement and the organic insulating layer and communicating to the first hole and a connecting material provided at least one of the first hole and the second hole to electrically connect the first terminal and the second terminal to each other.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority fromJapanese Patent Application No. 2017-012120, filed Jan. 26, 2017, theentire contents of which are incorporated herein by reference.

FIELD

Embodiments described herein relate generally to a display device and aninter-substrate conducting structure.

BACKGROUND

In recent years, various techniques for reducing the width of the framein display devices are being studied. One example discloses a techniqueof utilizing another connector (inter-substrate connector) whichelectrically connects a wiring portion comprising a contact-holeconnecting material inside a hole which penetrates an inner surface andan outer surface of a resin-made first substrate, and a wiring portionprovided on an inner surface of a resin-made second substrate to eachother.

SUMMARY

The present application generally relates to a display device and aninter-substrate conducting structure.

According to one embodiment, a display device includes a first substrateincluding a first basement and a first terminal, a second substrateopposing the first substrate and including a second basement and asecond terminal, an organic insulating layer located between the firstbasement and the second basement, a first hole penetrating the secondbasement and the organic insulating layer, a second hole penetrating atleast one of the second basement and the organic insulating layer andcommunicating to the first hole and a connecting material provided atleast one of the first hole and the second hole to electrically connectthe first terminal and the second terminal to each other.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view showing a configuration example of adisplay device of an embodiment.

FIG. 2 is a cross-sectional view showing an example of the displaydevice shown in FIG. 1.

FIG. 3 is a cross-sectional view showing an example of the displaydevice shown in FIG. 1.

FIG. 4 is a cross-sectional view showing an example of the displaydevice shown in FIG. 1.

FIG. 5 is a cross-sectional view showing an example of the displaydevice shown in FIG. 1.

FIG. 6 is a plan view showing a configuration example of the displaydevice of the embodiment.

FIG. 7 is a diagram showing a basic structure and an equivalent circuitof a display panel shown in FIG. 6.

FIG. 8 is a cross-sectional view showing the structure of a part of thedisplay panel shown in FIG. 6.

FIG. 9 is a plan view showing a configuration example of a sensor.

FIG. 10 is a cross section of the display panel taken along a line A-Bshown in FIG. 6 including a first hole.

FIG. 11 is a plan view showing an example of the structure of adetection electrode and a second terminal shown in FIG. 6.

FIG. 12 is a plan view showing another example of the structure of thedetection electrode and the second terminal shown in FIG. 6.

FIG. 13 is a plan view showing another example of the structure of thedetection electrode and the second terminal shown in FIG. 6.

FIG. 14 is a diagram showing a step of a method of manufacturing thedisplay device shown in FIG. 3.

FIG. 15 is a diagram showing a next step of the method of manufacturingthe display device shown in FIG. 3.

FIG. 16 is a diagram showing a next step of the method of manufacturingthe display device shown in FIG. 3.

FIG. 17 is a diagram showing a step of a method of manufacturing thedisplay device shown in FIG. 1.

FIG. 18 is a diagram showing a next step of the method of manufacturingthe display device shown in FIG. 1.

FIG. 19 is a diagram showing a next step of the method of manufacturingthe display device shown in FIG. 1.

FIG. 20 is a diagram showing a step of a method of manufacturing thedisplay device shown in FIG. 1.

FIG. 21 is a diagram showing a next step of the method of manufacturingthe display device shown in FIG. 5.

FIG. 22 is a diagram showing a next step of the method of manufacturingthe display device shown in FIG. 5.

FIG. 23 is a diagram showing a next step of the method of manufacturingthe display device shown in FIG. 5.

FIG. 24 is a diagram showing a step in a modification of the method ofmanufacturing the display device shown in FIG. 3.

FIG. 25 is a diagram showing a next step in the modification of themethod of manufacturing the display device shown in FIG. 3.

FIG. 26 is a diagram showing a next step in the modification of themethod of manufacturing the display device shown in FIG. 3.

FIG. 27 is a diagram showing a next step in the modification of themethod of manufacturing the display device shown in FIG. 3.

DETAILED DESCRIPTION

In general, according to one embodiment, a display device is provided,which comprises a first substrate comprising a first basement and afirst terminal, a second substrate opposing the first substrate andcomprising a second basement and a second terminal, an organicinsulating layer located between the first basement and the secondbasement, a first hole penetrating the second basement and the organicinsulating layer, a second hole penetrating at least one of the secondbasement and the organic insulating layer and communicating to the firsthole and a connecting material provided at least one of the first holeand the second hole to electrically connect the first terminal and thesecond terminal to each other.

According to another embodiment, an inter-substrate conducting structureis provided, which comprises a first substrate comprising a firstbasement and a first terminal, a second substrate opposing the firstsubstrate and comprising a second basement and a second terminal, anorganic insulating layer located between the first basement and thesecond basement, a first hole penetrating the second basement and theorganic insulating layer, a second hole penetrating at least one of thesecond basement and the organic insulating layer and communicating tothe first hole and a connecting material provided at least one of thefirst hole and the second hole to electrically connect the firstterminal and the second terminal to each other.

Embodiments will now be described with reference to accompanyingdrawings. Note that the disclosure is presented for the sake ofexemplification, and any modification and variation conceived within thescope and spirit of the invention by a person having ordinary skill inthe art are naturally encompassed in the scope of invention of thepresent application. Furthermore, a width, thickness, shape, and thelike of each element are depicted schematically in the figures ascompared to actual embodiments for the sake of simpler explanation, andthey do not limit the interpretation of the invention of the presentapplication. Furthermore, in the description and figures of the presentapplication, structural elements having the same or similar functionswill be referred to by the same reference numbers and detailedexplanations of them that are considered redundant may be omitted.

In the embodiment, a display device will be disclosed as an example ofthe electronic device. The display device can be used in, for example,various types of equipment such as smartphones, tablet terminals, mobiletelephone terminals, notebook personal computers, and game consoles. Themajor configuration explained in the present embodiment can also beapplied to a liquid crystal device, a self-luminous display devicecomprising an organic electroluminescent display element, and the like,an electronic paper display device comprising an electrophoreticelement, and the like, a display device employingmicro-electromechanical systems (MEMS), or a display device employingelectrochromism.

FIG. 1 is a cross sectional view showing a configuration example of adisplay device DSP of this embodiment. Here, a first direction X, asecond direction Y, and a third direction Z are orthogonal to eachother, but they may cross at an angle other than 90 degrees. The firstdirection X and the second direction Y are parallel to a surface of asubstrate of the display device DSP, and the third direction Z is athickness direction of the display device DSP. Here, FIG. 1 shows across sectional view of a part of the display device DSP in an X-Y planedefined by the first direction X, and the second direction Y.

The display device DSP comprises a first substrate SUB1, a secondsubstrate SUB2, an organic insulating layer OI, a connecting material C,and a filling material FI. The first substrate SUB1 and the secondsubstrate SUB2 oppose each other in the third direction Z. In thefollowing descriptions, the direction from the first substrate SUB1towards the second substrate SUB2 is defined as above (or simply up),and the direction from the second substrate SUB2 towards the firstsubstrate SUB1 is defined as below (or simply down). Viewing from thesecond substrate SUB2 towards the first substrate SUB1 is defined asplanar view.

The first substrate SUB1 comprises a first basement 10, a first terminalTM1, wirings WR, and a pad electrode PD. The first basement 10 comprisesa surface 10A opposing the second substrate SUB2 and another surface 10Bon an opposite side to the surface 10A. In the example illustrated, thefirst terminal TM1, wiring WR, and pad electrode PD are located on asurface 10A side. The wiring WR is disposed between the first terminalTM1 and the pad electrode PD. The first terminal TM1 and the padelectrode PD are electrically connected to each other via the wiring WR.Although not illustrated in the figure, various types of insulatinglayers and conducting layers may be disposed between the first basement10 and a group of the first terminal TM1, wiring WR and pad electrodePD, and on the first terminal TM1, the wiring WR and the pad electrodePD. Further, the first terminal TM1, the wiring WR, and the padelectrode PD may be formed in layers separate from each other via aninsulating layer or the like. Note that the first basement 10corresponds to a first insulating substrate, and the second basement 20corresponds to a second insulating substrate. As the first insulatingsubstrate and second insulating substrate, resin substrates can beadopted.

The second substrate SUB2 comprises a second basement 20, a secondterminal TM2, a detection electrode Rx and a protection material PT. Thesecond basement 20 comprises a surface (lower surface) 20A opposing thefirst substrate SUB1 and another surface (upper surface) 20B on anopposite side to the surface 20A. The surface 20A opposes the firstterminal TM1 and is spaced apart from the first terminal TM1 along thethird direction Z. The first basement 10 and the second basement 20 areformed from, for example, no-alkali glass. In the example illustrated,the second terminal TM2 and the detection electrode Rx are located on asurface 20B side. The second terminal TM2 and the detection electrode Rxare electrically connected to each other. The protection material PT isdisposed on the detection electrode Rx and the second terminal TM2.Although not illustrated, various types of insulating layers andconducting layers may be provided between a group of the second terminalTM2 and detection electrode Rx and the second basement 20.

The organic insulating layer OI is located between the first basement 10and the second basement 20. Further, the organic insulating layer OI islocated also on the first terminal TM1 and the wiring WR. Here, theorganic insulating layer OI includes, for example, a light-shieldinglayer, a color filter, an overcoat layer, and an alignment film, whichwill be described later, and also a sealing material which adheres thefirst substrate SUB1 and the second substrate SUB2 to each other.

A wiring substrate SUB3 is mounted on the first substrate SUB1 so as tobe electrically connected to the pad electrode PD. The wiring substrateSUB3 having such configuration is, for example, a flexible substratewith flexibility. Note that a flexible substrate applicable to thisembodiment should only comprise at least partially a flexible portion ofa bendable material. For example, the wiring substrate SUB3 of thisembodiment each may be a flexible substrate in its entirety, or may be arigid flexible substrate comprising a rigid portion formed of a rigidmaterial such as glass epoxy and a flexible portion formed of a bendablematerial such as polyimide.

Here, a connection structure between the first terminal TM1 and thesecond terminal TM2 in this embodiment will be described in detail. Thedisplay device DSP comprises a first hole V1 and a second hole V2. Thefirst hole V1 includes a hole portion (first hole portion) VA1 formed inthe second substrate SUB2, which penetrates the second basement 20. Thehole portion VA1 penetrates from the surface 20B to the surface 20A. Inthe example illustrated, the hole portion VA1 penetrates the secondterminal TM2 as well.

The first hole V1 also includes a hole portion (second hole portion) VB1which penetrates the organic insulating layer OI. The hole portion VB1is communicated to the hole portion VA1.

The first hole V1 comprises a hole portion VC1 in the first substrateSUB1, which penetrates the first terminal TM1. The hole portion VC1 iscommunicated with the hole portion VB1. Further, the first hole V1includes a concavity CC 1 formed in the first basement 10. The concavityCC 1 opposes the hole portion VC1 along the third direction Z. Theconcavity CC 1 is formed from the surface 10A toward the surface 10B,but in the example illustrated, it does not penetrate to the surface10B. For example, the depth of the concavity CC along the thirddirection Z is about ⅕ to ½ of the thickness of the first basement 10along the third direction Z. Note that the first basement 10 maycomprise a hole which penetrates from the surface 10A to the surfaces10B in place of the concavity CC. The hole portions VB1 and VC1 and theconcavity CC are each located directly under the hole portion VA1. Thehole portions VA1, VB1 and VC1 and the concavity CC are arranged on thesame straight line along the third direction Z.

In the example illustrated, the hole portion VB1 is expanded in thesecond direction Y as compared to the hole portions VA1 and VC1. Thehole portion VB1 is expanded not only in the second direction Y but alsoin all directions in the X-Y plane further than the hole portions VA1and VC1.

The second hole V2 comprises a hole portion (third hole portion) VA2 inthe second substrate SUB2, which penetrates the second basement 20. Thehole portion VA2 penetrates from the surface 20B to the surface 20A. Inthe example illustrated, the hole portion VA2 penetrates the secondterminal TM2 as well.

The second hole V2 also comprises a hole portion (fourth hole portion)VB2 which penetrates the organic insulating layer OI between the firstsubstrate SUB1 and the second substrate SUB2. The hole portion VB2 iscommunicated with the hole portion VA2. Further, the hole portion VB2 iscommunicated with the hole portion VB1 along the second direction Y, toform one hole portion together with the hole portion VB1.

In the first hole V1, for example, the hole portion VA1 is formed intoapproximately a cylindrical shape, but the hole portion VA1 may beformed to be tapered off from the top toward the bottom. Further, in thesecond hole V2, for example, the hole portion VA2 is formed intoapproximately a cylindrical shape, but the hole portion VB1 may beformed to be tapers off from the top toward the bottom.

Here, the first hole V1 has a central axis AX1 along the extendingdirection of the first hole V1. The second hole V2 has a central axisAX2 along the extending direction of the second hole V2. In the exampleillustrated, the central axis AX2 is inclined with respect to thecentral axis AX1. More specifically, the central axis AX1 is parallel tothe third direction Z, and the central axis AX2 is inclined with respectto the third direction Z. The second hole V2 is communicated with thefirst hole V1. In the example illustrated, the second hole V2 iscommunicated with the hole portions VA1 and VB1.

As described above, the first hole V1 and the second hole V2 eachpenetrate the second basement 20 and the organic insulating layer OI.Note here it suffices if the second hole V2 penetrates at least one ofthe second basement 20 and the organic insulating layer OI to becommunicated with the first hole V1. More specifically, as will bedescribed later, the second hole V2 may penetrate the second basement 20between the surface 20B and the hole portion VA1 or may penetrate theorganic insulating layer OI between an outer end of the organicinsulating layer OI and the hole portion VB1. Further, the second holeV2 may be formed parallel to the first hole V1.

The first hole V1 has an opening OP1 opened upward from the secondsubstrate SUB2. The second hole V2 has an opening OP2 opened upwardsfrom the second substrate SUB2. In the example illustrated, the openingsOP1 and OP2 are located in an upper surface LT of the second terminalTM22 and spaced apart from each other. In other words, the secondbasement 20 is interposed between the hole portion VA1 and the holeportion VA2.

The connecting material C is provided through the first hole V1 and thesecond hole V2 to electrically connected the first terminal TM1 and thesecond terminal TM2 to each other. The connecting material C shouldpreferably contain a metal material such as silver and fine particleshaving a diameter of the order of from several nanometers to tens ofnanometers, with which the metal material is mixed. In the first holeV1, the connecting material C is provided on an inner surface of each ofthe hole portions VA1, VB1, VC1 and the concavity CC 1, and in thesecond hole V2, it is provided on an inner surface of each of the holeportions VA2 and VB2. In the example illustrated, the connectingmaterial C is in contact with the upper surface LT2, inner surfaces LS21and LS22 of the second terminal TM2, and inner surfaces 2015 and 202S ofthe second basement 20. The inner surfaces LS21 and 2015 form the innersurface of the hole portion VA1. The inner surfaces LS22 and 202S formthe inner surface of the hole portion VA2.

The connecting material C is in contact with an inner surface OIS of theorganic insulating layer OI. The inner surface OIS forms an innersurface of a hole portion formed by communicating the hole portions VB1and VB2 to each other. Further, the connecting material C is also incontact with each of the inner surface LS1 of the first terminal TM1 andthe concavity CC1 in the first substrate SUB1. The inner surface LS1forms the inner surface of the hole portion VC1.

In the example illustrated, the connecting material C is formed withoutinterruption through the first hole V1 and the second hole V2. Note thatthe connecting material C should only electrically connect the firstterminal TM1 and the second terminal TM2 to each other via at least oneof the first hole V1 and the second hole V2.

In the example illustrated, the connecting material C is formed on theinner surfaces of the first hole V1 and the second hole V2, but it maybe provided to fill at least one of the first hole V1 and the secondhole V2 to be buried. In this case as well, the connecting material C isformed continuously without interruption between the first terminal TM1and the second terminal TM2.

Note that since the solvent for the connecting material C in thisembodiment evaporates in the manufacturing process, the connectingmaterial C, which attaches to the wall surfaces of the first hole V1 andthe second hole V2, may be formed in the form of a thin film of a metalmaterial.

Hollow portions of the first hole V1 and the second hole V2 are filledwith the filling material FI. Further, the filling material FI isdisposed above the second terminal TM2 as well to cover the connectingmaterial C. The filling material FI has, for example, insulatingproperties, and is formed from an organic insulating material. Thus,with the filling material FI, a level difference along the thirddirection Z resulting from the hollow portions formed in the first holeV1 and the second hole V2 can be reduced. Further, the connectingmaterial C can be protected. Moreover, the filling material FI may haveconductivity and, for example, may be a material obtained by hardening apaste containing conductive particles such as of silver. In the casewhere the filling material FI has conductivity, even if the connectingmaterial C is come down in the in the first hole V1 and the second holeV2, the filling material FI can electrically connect the first terminalTM1 and the second terminal TM2 to each other, thereby making itpossible to improve the reliability.

With the above-described structure, the second terminal TM2 iselectrically connected to the wiring substrate SUB3 via the connectingmaterial C, the first terminal TM1 and the like. Thus, control circuitsfor writing signals to the detection electrode Rx or reading signalsoutput therefrom are connected to the detection electrode Rx via thewiring substrate SUB3. In other words, in order to connect the detectionelectrode Rx and the control circuits to each other, it is not necessaryto provide a wiring substrate SUB4, indicated by dotted line in FIG. 1,in the second substrate SUB2.

FIG. 2 is a cross sectional view showing an example of the displaydevice DSP shown in FIG. 1. Here, only the main part necessary forexplanation is illustrated. The structure shown in FIG. 2 is differentfrom that of FIG. 1 in that the second hole V2 does not penetrate theorganic insulating layer OI.

That is, the second hole V2 penetrates the second basement 20 betweenthe surface 20B and the hole portion VA1. Here, the openings OP1 and OP2are spaced from each other. Note, as shown in FIG. 2, a protectionmaterial PT may not necessarily be provided above the second terminalTM2 between the opening OP1 and the opening OP2, but the fillingmaterial FI may be provided there.

FIG. 3 is a cross sectional view showing an example of the displaydevice DSP shown in FIG. 1. The structure shown in FIG. 2 is differentfrom that of FIG. 1 in that the second hole V2 is parallel to the firsthole V1.

The second hole V2 comprises, in the first substrate SUB1, a holeportion VC2 which penetrates the first terminal TM1 and a concavity CC2formed in the first basement 10 in addition to the hole portions VA2 andVB2. The hole portion VC2 is communicated with the hole portion VB2. Theconcavity CC2 opposes the hole portion VC2 along the third direction Z.In the example illustrated, the hole portions VA1 and VA2 are spacedfrom each other along the second direction Y. In other words, the secondbasement 20 and the second terminal TM2 are interposed between the holeportion VA1 and the hole portion VA2. Here, the openings OP1 and OP2 arespaced from each other. The hole portion VB2 is expanded in the seconddirection Y as compared to the hole portions VA2 and VC2. The holeportion VB2 is expanded not only in the second direction Y but in alldirections in the X-Y plane as compared to the hole portions VA2 andVC2. Thus, the hole portions VB1 and VB2 are communicated with eachother along the second direction Y. Further, the hole portions VC1 andVC2 are spaced from each other along the second direction Y. In otherwords, the first terminal TM1 is interposed between the hole portion VC1and the hole portion VC2. Moreover, the concavities CC1 and CC2 arespaced from each other along the second direction Y. In other words, thefirst basement 10 is interposed between the concavity CC1 and theconcavity CC2.

FIG. 4 is a cross sectional view showing an example of the displaydevice DSP shown in FIG. 1. The structure shown in FIG. 4 is differentfrom that of FIG. 3 in that the second hole V2 and the first hole V1 arecommunicated to each other along the second direction Y.

Here, the openings OP1 and OP2 are communicated to each other. The holeportions VB1 and VB2 are communicated to each other along the seconddirection Y. The hole portions VC1 and VC2 are communicated to eachother along the second direction Y. The concavities CC1 and CC2 arecommunicated to each other along the second direction Y. That is, thesecond hole V2 is communicated to the first hole V1 along the seconddirection Y continuously from the hole portion VA2 to the concavity CC2.

FIG. 5 is a cross sectional view showing an example of the displaydevice DSP shown in FIG. 1. The cross section shown here is taken alongthe X-Z plane defined by the first direction X and the third directionZ. The structure shown in FIG. 5 is different from that of FIG. 1 in theposition of the second hole V2.

In the example illustrated, the second hole V2 does not penetrate thesecond basement 20, but penetrates the organic insulating layer OI. Thesecond hole V2 penetrates the organic insulating layer OI between anouter end portion OIE of the organic insulating layer OI and the firsthole V1. In the example illustrated, the second hole V2 penetrates fromthe outer end portion OIE to the hole portion VB1. Here, the opening OP2is located in the outer end portion OIE. Moreover, the connectingmaterial C is not disposed on the inner surface of the second hole V2.

FIG. 6 is a plan view showing a configuration example of the displaydevice DSP of this embodiment. Here, a plane of the display device DSPtaken along the X-Y plane defined by the first direction X and thesecond direction Y is shown.

The display device DSP comprises a display panel PNL, an IC chip I1, awiring substrate SUB3 and the like. The display panel PNL is a liquidcrystal display panel, and comprises a first substrate SUB1, a secondsubstrate SUB2, a sealing material SE and a display function layerequivalent to a liquid crystal layer. The second substrate SUB2 opposesthe first substrate SUB1. The sealing material SE corresponds to aportion hatched by lines upwardly slanting to the right in FIG. 6 andattaches the first substrate SUB1 and the second substrate SUB2together.

The display panel PNL comprises a display area DA which displays imagesand a frame-shaped non-display area NDA surrounding the display area DA.The sealing material SE is located in the non-display area NDA and thedisplay area DA is located in an inner side encircled by the sealingmaterial SE.

The wiring substrate SUB3 is mounted on the first substrate SUB1. The ICchip I1 is mounted on the wiring substrate SUB3. Note that thisconfiguration is not limited to the example illustrated, but the IC chipI1 may be mounted on the portion of the first substrate SUB1, whichextends out from the second substrate SUB2, or on an external circuitboard connected to the wiring substrate SUB3. The IC chip I1 includes,for example, a built-in display driver DD which outputs a signalrequired to display images. The display driver DD described herecontains at least a part of signal line drive circuits SD, scanning linedrive circuits GD and common electrode drive circuits CD, which will bedescribed later. In the example illustrated, the IC chip I1 contains abuilt-in detector RC which functions as a touch-panel controller or thelike. The detector RC may be built in the IC chip I1 or an IC chip otherthan the IC chip I1.

The display panel PNL may be, for example, any one of a transmissivetype which displays images by selectively transmitting light from belowthe first substrate SUB1, a reflective type which displays images byselectively reflecting light from above the second substrate SUB2 and atrans-reflective type comprising a transmissive display function and areflective display function.

A sensor SS carries out sensing to detect contact or approaching of anobject with respect to the display device DSP. The sensor SS comprises aplurality of detection electrodes Rx (only one of which is shown in thefigure). The detection electrodes Rx are each formed on the secondsubstrate SUB2. These detection electrodes Rx each extend in the firstdirection X and are arranged along the second direction Y with gapstherebetween. Here, in FIG. 6, the left-hand side region to the displayarea DA is defined as one end side, and the right-hand side region tothe display area DA is defined as the other end side.

The detection electrodes Rx each comprise a detector RS, and a connectorCN1. The detector RS is located in the display area DA and extends inthe first direction X. In the detection electrode Rx, the detector RS ismainly used for sensing. In the example illustrated, the detector RS isformed into a stripe shape, but more specifically, it is formed from anaggregate of fine metal thin wires as will be illustrated with referenceto FIG. 11. Further, one detection electrode Rx comprises two detectorsRS, but may comprise three or more detectors RS, or may comprise onlyone detector RS. The terminal RT is located on the other end side of thenon-display area NDA along the first direction X and connects aplurality of detectors RS to each other.

The detection electrode Rx is connected to the second terminal TM2. Thesecond terminal TM2 is formed in a position overlapping the sealingmaterial SE in plan view. The second terminal TM2 is located on one endside of the non-display area NDA along the first direction X and isconnected to the detector RS.

On the other hand, the first substrate SUB1 comprises a first terminalTM1 and a wiring W1, electrically connected to the wiring substrateSUB3. The first terminal TM1 and the wiring W1 are located in the oneend side of the non-display area NDA and overlap the sealing material SEin plan view. The first terminal TM1 is formed in a position whichoverlaps the second terminal TM2 in plan view. The wiring W1 isconnected to the first terminal TM1, extending along the seconddirection Y, and is electrically connected to the detector RC of the ICchip I1 via the wiring substrate SUB3.

The first hole V1 is formed in a position where the second terminal TM2and the first terminal TM1 oppose each other. The second hole V2 isaligned with the first hole V1 along the second direction Y. Asdescribed above, the connecting material C having conductivity isprovided in at least one of the first hole V1 and the second hole V2.With this structure, the second terminal TM2 and the first terminal TM1are electrically connected to each other. That is, the detectionelectrode Rx provided in the second substrate SUB2 is electricallyconnected with a detector circuit RC via the wiring substrate SUB3connected to the first substrate SUB1. The detector RC reads a sensorsignal output from the detection electrode Rx to detect whether anobject contacts or approaches, and the position coordinate of the objectdetected, etc.

In the example illustrated, the first hole V1 and the second hole V2 arecircular in planar view, but the shape thereof is not limited to that ofthe example illustrated, but may be some other shape such as elliptical.

The wiring W1 is connected to the detection electrode Rx via the firstterminal TM1, and therefore when the wiring W1 connected to thedetection electrode Rx is formed on a first substrate SUB1 side, theregion for forming the wiring W1 in the second substrate SUB2 is nolonger necessary. Consequently, the region for arranging other memberscan be expanded, and further the degree of freedom in the layout of theshape of the second substrate SUB2 can be improved.

FIG. 7 is a diagram showing a basic structure and an equivalent circuitof the display panel PNL shown in FIG. 6.

The display panel PNL comprises a plurality of pixels PX in the displayarea DA. Here, each pixel indicates a minimum unit individuallycontrollable according to a pixel signal, and exists in the regioncontaining a switching element provided at a position where a scanningline and a signal line cross each other, for example, which will bedescribed later. The pixels PX are arranged in a matrix along the firstdirection X and the second direction Y. Further, the display panel PNLcomprises a plurality of scanning lines G (G1 to Gn), a plurality ofsignal lines S (S1 to Sm), common electrodes CE, etc., in the displayarea DA. The scanning lines G each extend along the first direction Xand are arranged along the second direction Y. The signal lines S eachextend along the second direction Y and are arranged along the firstdirection X. The scanning lines G and the signal lines S are notnecessarily formed to extend linearly, but may be partially bent. Thecommon electrodes CE are each provided for a plurality of pixels PX. Thescanning lines G, the signal lines S and the common electrodes CE areall drawn out to the non-display area NDA. In the non-display area NDA,the scanning lines G are connected to the scanning line drive circuitGD, the signal lines S are connected to the signal line drive circuitSD, and the common electrodes CE are connected to the common electrodedrive circuit CD. The signal line drive circuit SD, the scanning linedrive circuit GD and the common electrode drive circuit CD may be formedon the first substrate SUB1 or partially or entirely built in the ICchip I1 shown in FIG. 1.

Each pixel PX comprises a switching element SW, a pixel electrode PE, acommon electrode CE, a liquid crystal layer LC, etc. The switchingelement SW is, for example, a thin film transistor (TFT) and iselectrically connected to a respective scanning line G and a respectivesignal line S. More specifically, the switching element PSW comprises agate electrode WG, a source electrode WS and a drain electrode WD. Thegate electrode WG is electrically connected to the scanning line G. Inthe example illustrated, the electrode electrically connected to thesignal line S is referred to as the source electrode WS, and theelectrode electrically connected to the pixel electrode PE is referredto as the drain electrode WD.

The scanning line G is connected to the switching element PSW in each ofthose pixels PX which are arranged along the first direction X. Thesignal line S is connected to the switching element PSW in each of thosepixels PX arranged along the second direction Y. Each of the pixelelectrodes PE opposes the respective common electrode CE and drives theliquid crystal layer LC with an electric field produced between thepixel electrode PE and the common electrode CE. A storage capacitor CSis formed, for example, between the common electrode CE and the pixelelectrode PE.

FIG. 8 is a cross section showing a part of structures of the displaypanel PNL shown in FIG. 6.

The display panel PNL illustrated here has a structure provided for thedisplay mode which mainly uses a lateral electric field substantiallyparallel to a surface of the substrate. The display panel PNL may have astructure provided for display mode using a vertical electric fieldperpendicular to the surface of the substrate, or an electric fieldoblique to the surface, or a combination thereof. To the display modeusing a lateral electric field, for example, such a structure isapplicable, that both of the pixel electrode PE and the common electrodeCE are provided one of the first substrate SUB1 and the second substrateSUB2. To the display mode using a vertical electric field or an obliqueelectric field, for example, such a structure is applicable, that one ofthe pixel electrode PE and the common electrode CE is provided on thefirst substrate SUB1, and the other one of the pixel electrode PE andthe common electrode CE is provided on the second substrate SUB2. Notethat the surface of the substrate here is that parallel to the X-Yplane.

The first substrate SUB1 comprises a first basement 10, signal lines S,a common electrode CE, metal layers M, a pixel electrode PE, a firstinsulating layer 11, a second insulating layer 12, a third insulatinglayer 13, a first alignment film AL1, etc. Note that the illustration ofthe switching element, scanning lines and various insulating layersinterposed between these, etc., is omitted.

The first insulating layer 11 is located on the surface 10A of the firstbasement 10. The signal lines S are located on the first insulatinglayer 11. The second insulating layer 12 is located on the signal linesS and the first insulating layer 11. The common electrode CE is locatedon the second insulating layer 12. The metal layers M are in contactwith the common electrode CE at positions directly above the signallines S, respectively. In the example illustrated, the metal layers Mare located on the common electrode CE, but may be located between thecommon electrode CE and the second insulating layer 12. The thirdinsulating layer 13 is located on the common electrode CE and the metallayers M. The pixel electrode PE is located on the third insulatinglayer 13. The pixel electrode PE opposes the common electrode CE via thethird insulating layer 13. The pixel electrode PE comprises a slit SL ina position opposing the common electrode CE. The first alignment filmAL1 covers the pixel electrode PE and the third insulating layer 13.

The structure of the first substrate SUB1 is not limited to the exampleillustrated, but the pixel electrode PE may be located between thesecond insulating layer 12 and the third insulating layer 13 and thecommon electrode CE may be located between the third insulating layer 13and the first alignment film AL1. In such a case, the pixel electrode PEis formed into a plate shape without a slit, and the common electrode CEis formed to comprise a slit which opposes the pixel electrodes PE.Alternatively, both of the pixel electrode PE and the common electrodeCE may be each formed into a comb teeth shape and arranged to engagewith each other in gear.

The second substrate SUB2 comprises a second basement 20,light-shielding layers BM, color filters CF, an overcoat layer OC, asecond alignment film AL2, etc.

The light-shielding layers BM and the color filters CF are located inthe surface 20A of the second basement 20. The light-shielding layers BMpartition the pixels from each other and are located directly above thesignal lines S, respectively. The color filters CF oppose the pixelelectrodes PE and partially overlap the respective light-shieldinglayers BM. The color filter CF includes a red color filter, a greencolor filter, a blue color filter and the like. The overcoat layer OCcovers the color filter CF. The second alignment film AL2 covers theovercoat layer OC.

The color filter CF may be disposed on the first substrate SUB1. Thecolor filter CF may include color filters of four or more colors. On apixel to display a white color, a white color filter or an uncoloredresin material may be disposed or the overcoat layer OC may be disposedwithout disposing the color filter.

The detection electrode Rx is located on the surface 20B of the secondbasement 20. The detection electrodes Rx may be formed from a conductivelayer containing a metal or a transparent conductive material such asITO or IZO, or formed by depositing a transparent conductive layer on aconductive layer containing a metal, or formed of a conductive organicmaterial or a dispersing element of a fine conductive material or thelike.

A first optical element OD1 including a first polarizer PL1 is locatedbetween the first basement 10 and an illumination device BL. A secondoptical element OD2 including a second polarizer PL2 is located on thedetection electrodes Rx. Each of the first optical element OD1 and thesecond optical element OD2 may include a retardation film as needed.

The scanning lines, the signal lines S and the metal layers M are eachformed from a metal material such as molybdenum, tungsten, titanium oraluminum and may be formed in a single- or multi-layer structure. Forexample, the scanning lines are formed of a metal material containingmolybdenum and tungsten, the signal lines S are formed of a metalmaterial containing titanium and aluminum, and the metal layer M isformed of a metal material containing molybdenum and aluminum. Thecommon electrodes CE and the pixel electrodes PE are each formed of atransparent conductive material such as ITO or IZO. The first insulatinglayer 11 and the third insulating layer 13 are inorganic insulatinglayers while the second insulating layer 12 is an organic insulatinglayer.

Next, a configuration example of the sensor SS built in the displaydevice DSP of this embodiment will be explained. The sensor SS explainedbelow is, for example, a capacitive sensor of a mutual-capacitive type,which detects contact or approach of an object, based on the variationin electrostatic capacitance between a pair of electrodes opposing via adielectric.

FIG. 9 is a plan view showing a configuration example of the sensor SS.

In the configuration example illustrated, the sensor SS comprises sensordrive electrodes Tx and detection electrodes Rx. In the exampleillustrated, the sensor drive electrodes Tx correspond to portionshatched by lines downwardly slanting to the right and are provided onthe first substrate SUB1. The detection electrodes Rx correspond toportions hatched by lines upwardly slanting to the right and areprovided on the second substrate SUB2. The drive electrodes Tx and thedetection electrodes Rx cross each other in the X-Y plane. The detectionelectrodes Rx oppose the sensor drive electrodes Tx along the thirddirection Z.

The sensor drive electrodes Tx and the detection electrodes Rx arelocated in the display area DA and some of the electrodes extend out tothe non-display area NDA. In the example illustrated, the driveelectrodes Tx are each formed into a strip shape extending along thesecond direction Y and arranged along the first direction X to be spacedfrom each other. The detection electrodes Rx each extend along the firstdirection X and are arranged along the second direction Y to be spacedfrom each other. As explained with reference to FIG. 6, the detectionelectrodes Rx are connected to the first terminal provided on the firstsubstrate SUB1 and electrically connected to the detection circuit RCvia the wirings. Each of the sensor drive electrodes Tx is electricallyconnected to the common electrode drive circuit CD via a wiring WR. Thenumber, size and shape of the sensor drive electrodes Tx and thedetection electrodes Rx are not particularly limited but can bevariously changed.

The sensor drive electrodes Tx each function as the above-describedcommon electrode CE. In other words, they have a function of generatingan electric field between itself and the respective pixel electrode PEand also a function of detecting the position of the object bygenerating the capacitance between itself and the respective detectionelectrode Rx.

The common electrode driving circuit CD supplies common drive signals tothe drive electrodes Tx including the common electrode CE at the displaydriving time to display images on the display area DA. Further, thecommon electrode drive circuit CD supplies sensor drive signals to thesensor drive electrodes Tx at the sensing driving time to executesensing. The detection electrodes Rx generate electrostatic capacitancebetween the sensor drive electrodes Tx and themselves in accordance withsupply of the sensor drive signals to the sensor drive electrodes Tx.The electrostatic capacitance varies as an object to be detected such asa fmger approaches. From the detection electrodes Rx, the detectionsignals based on the electrostatic capacitance are output. The detectionsignals output from the detection electrodes Rx are input to thedetection circuit RC shown in FIG. 6.

The sensor SS in each of the above-explained configuration examples isnot limited to the sensor of the mutual-capacitive type which detectsobjects based the variation in electrostatic capacitance between a pairof electrodes (in the above case, the electrostatic capacitance betweenthe drive electrodes Tx and the detection electrodes Rx), but may be aself-capacitive type which detects objects based on the variation inelectrostatic capacitance between the detection electrodes Rx.

In the example illustrated, the sensor drive electrodes Tx each extendalong the second direction Y and arranged along the first direction Xwith a gap between each adjacent pair, but the sensor drive electrodesTx each may extend along the first direction X and arranged along thesecond direction Y with a gap between each adjacent pair. In this case,the detection electrodes Rx each extend along the second direction Y andare arranged along the first direction X with a gap between eachadjacent pair.

FIG. 10 is a cross-sectional view showing the display panel PNLincluding the first hole V1 shown in FIG. 6 as taken along in line A-B.Here, only main parts necessary for the explanation are shown, and thefirst and second alignment films and the like are omitted from theillustration. Further, the structure shown in FIG. 10 is a specificexample of that shown in FIG. 1, and explanation of the membersoverlapping those of FIG. 1 will be omitted. Note that FIG. 1 shows across section in the Y-Z plane, whereas FIG. 10 shows a cross section inthe X-Z plane.

In the example illustrated, the display device DSP comprises a firstsubstrate SUB1, a second substrate SUB2, a sealing material SE, a liquidcrystal layer LC, a connecting material C and a filling material FI.

The first substrate SUB1 includes a first basement 10, a first terminalTM1, wirings W, a first insulating layer 11, a second insulating layer12, a third insulating layer 13, a third terminal TM3, etc.

The first insulating layer 11 comprises an insulating layer 111, aninsulating layer 112 and an insulating layer 113. The insulating layer111, the insulating layer 112, and the insulating layer 113 are stackedin this order on the first basement 10. The first insulating layer 11comprises a concavity GR. In the example illustrated, the concavity GRpenetrates the insulating layers 112 and 113 to the insulating layer111. Although will not be explained in detail, the semiconductor layerof the switching element is disposed between the insulating layer 111and the insulating layer 112 in the display area, and the scanning linesG shown in FIG. 7 are disposed between the insulating layer 112 and theinsulating layer 113.

In the example illustrated, the first terminal TM1 is located on thesurface 10A side of the first basement 10, and disposed inside theconcavity GR. In other words, the first terminal TM1 is in contact withthe insulating layer 111. The wirings W are arranged on the insulatinglayer 113. Here, the wirings W are located in the same layer as that ofthe signal lines formed in the display area, for example. In thisembodiment, the first terminal TM1 is formed together with, for example,the signal lines S shown in FIG. 7 at once from the same material. Thesecond insulating layer 12 covers the first terminal TM1 and the wiringsW and is disposed also on the insulating layer 113. The third insulatinglayer 13 is disposed on the second insulating layer 12.

Note that the concavity GR may penetrate the insulating layer 111 to thefirst basement 10 in the position where the concavity GR overlaps theinsulating layer 111, and the first terminal TM1 disposed inside theconcavity GR may be in contact with the first basement 10.

The third terminal TM3 is located between the second insulating layer 12and the sealing material SE. The third terminal TM3 is electricallyconnected to the first terminal TM1 via a contact hole CH whichpenetrates the second insulating layer 12 to the first terminal TM1. Thethird terminal TM3 with such configuration is located in the same layeras that of the metal layer M described with reference to FIG. 8. Thethird terminal TM3 is formed together with, for example, the metal layerM shown in FIG. 8 at once from the same material.

The second substrate SUB2 comprises a second basement 20, a secondterminal TM2, detection electrodes Rx, a light-shielding layer BM, anovercoat layer OC, etc.

The light-shielding layer BM is located on the surface 20A of the secondbasement 20. The overcoat layer OC covers the light-shielding layer BM.

The sealing material SE is located between the first substrate SUB1 andthe second substrate SUB2. The liquid crystal layer LC is located in theregion surrounded by the first substrate SUB1, the second substrate SUB2and the sealing material SE. In the example illustrated, the lightshielding layer BM, the overcoat layer OC and the sealing material SEcorrespond to the organic insulating layer OI.

Although will not be illustrated, the first alignment film may beprovided on a sealing material SE side of the first substrate SUB1.Further, the second alignment film may be provided on a sealing materialSE side of the second substrate SUB2.

The first terminal TM1 and the second terminal TM2 are formed of a metalmaterial such as molybdenum, tungsten, titanium, aluminum, silver,copper or chromium, or an alloy of any combination of these, or atransparent conductive material such as an indium tin oxide (ITO) or anindium zinc oxide (IZO), and may be of a single- or multi-layerstructure. The first terminal TM1 is formed from a metal materialcontaining, for example, aluminum and it is preferable in terms ofmanufacturing process not to use a metal material containing a materialwith higher melting point as compared to that of aluminum, which is, forexample, molybdenum or tungsten.

In the example illustrated, the hole portion VA1 penetrates the secondterminal TM2 and the second basement 20, the hole portion VB1 penetratesthe light-shielding layer BM, the overcoat layer OC and the sealingmaterial SE, and the hole portion VC1 penetrates the third terminal TM3,the second insulating layer 12, the first terminal TM1 and theinsulating layer 111.

In the example illustrated, the third terminal TM3 projects out in thefirst hole V1. With this structure, the contact area between the thirdterminal TM3 and the connecting material C can be increased in the firsthole V1. Thus, it is possible to improve the reliability of theconduction between the connecting material C and the first terminal TM1via the third terminal TM3.

FIG. 11 is a plan view showing a configuration example of the detectionelectrodes Rx and the second terminal TM2 shown in FIG. 6.

In the example shown in FIG. 11, part (A), the display device DSPcomprises second terminal portions TM21 and TM22, connection wirings CW1and CW2 and a detection electrode Rx. The second terminal portions TM21and TM22 are each formed in a ring shape. The second terminal TM21 isconnected to the detection electrode Rx via the connection wiring CW1.The second terminal TM22 is connected to the detection electrode Rx viathe connection wiring CW2. The detection electrode Rx is formed frommeshed metal thin wires MS. An opening OP1 is formed on an inner side ofthe second terminal TM21. An opening OP2 is formed on an inner side ofthe second terminal TM22. The openings OP1 and OP2 are arranged alongthe second direction Y and spaced from each other in plan view. That is,the first hole V1 and the second hole V2 are communicated to each otherinside, but the openings OP1 and OP2 thereof are spaced from each other.

As will be explained later, the connecting material C is injected to oneof the first hole V1 and the second hole V2 and an air bubble is emittedfrom the other while forming the connecting material C. In the exampleillustrated, both of the first hole V1 and the second hole V2 are formedas holes to connect the first and second terminal portions TM21 and TM22to each other. In such a case, the first hole V1 and the second hole V2are formed simultaneously, for example.

The structure shown in FIG. 11, part (B) is different from that of FIG.11, part (A) in that a second terminal portion TM22 connected to thedetection electrode Rx is not provided in the vicinity of the secondhole V2.

In the example illustrated, the first hole V1 is formed as a hole toconnect the first terminal and the second terminal portion TM21 to eachother. With such a structure, in case of a continuity error of theconnecting material C occurring, for example, in the first hole V1, ifthe connecting material C is injected from the second hole V2, theconnecting material C is continuously formed inside the first hole V1,thereby making it possible to recover the conduction error. Morespecifically, when the first hole V1 and the connecting material C areonce formed, they are subjected to inspection of the continuity of theconnecting material C in the first hole V1. If, here, a continuity erroris found, the second hole V2 is formed.

Note that the shape of the detection electrode Rx is not limited to thatillustrated in the example, but may be, for example, wavy, or some othershape such as sawtooth or sine wave.

Moreover, FIG. 11 corresponds to the structure in which the openings OP1and OP2 are spaced from each other, as shown in FIGS. 1 to 3.

FIG. 12 is a plan view showing another example of the detectionelectrode Rx and the second terminal TM2 shown in FIG. 6. The structureshown in FIG. 12 is different from that of FIG. 11, part (B) in theposition of the second hole V2.

FIG. 12 shows the case where the second hole V2 penetrates from theouter end portion OIE of the organic insulating layer OI to the firsthole V1, as shown in FIG. 5. Here, the opening OP2 is located in theouter end portion OIE.

FIG. 13 is a plan view showing another example of the detectionelectrode Rx and the second terminal TM2 shown in FIG. 6. The structureshown in FIG. 13 is different from that of FIG. 11, part (B) in that theopening OP2 is communicated to the opening OP1.

FIG. 13 shows the case where the first hole V1 and the second hole V2are communicated to each other as shown in FIG. 4. More specifically,the openings OP1 and OP2 are communicated to and partially overlap eachother in plan view. Note that the second terminal TM21 is interrupted ina position which overlaps the opening OP2, for example.

Next, an example of the method of manufacturing the display device DSPdescribed above will be described with reference to FIGS. 14 to 16.

FIGS. 14 to 16 illustrate a method of manufacturing the display deviceDSP shown in FIG. 3. Note that FIG. 14 shows a processing step after apart of the protection material PT disposed on the second terminal TM2is removed by laser beam.

As shown in FIG. 14, laser beam LL1 is irradiated from above the secondsubstrate SUB2. As the laser beam source, for example, a carbon dioxidegas laser is applicable, but various devices, as long as being able todrill a hole in a glass material or organic material, may be used aswell, including an excimer laser device. With the irradiating of thelaser beam LL1, the first hole V1 is formed. Subsequently, the secondhole V2 is formed by irradiating laser beam LL2 from above the secondsubstrate SUB2. The laser beams LL1 and LL2 are the same laser beams.With the irradiation of the laser beam LL1, the hole portion VB1 formedin the organic insulating layer OI is expanded along the X-Y directionswith respect to the hole portions VA1 and VC1. Further, with theirradiation of the laser beam LL2, the hole portion VB2 formed in theorganic insulating layer OI is expanded along the X-Y direction withrespect to the hole portions VA2 and VC2. Thus, the hole portions VB1and VB2 are communicated to each other. That is, the first hole V1 andthe second hole V2 can be communicated to each other in the layer wherethe organic insulating layer OI is located.

Then, as shown in FIG. 15, the connecting material C which electricallyconnects the first terminal TM1 and the second terminal TM2 to eachother is formed. First, a conductive material CM is injected into thesecond hole V2. Here, the conductive material CM is injected to thesecond hole V2 along a direction a, and an air bubble BB is emitted tothe outside of the first hole V1 along a direction b. That is, theconductive material CM is injected to from the second hole V2, and theair bubble BB is emitted from the first hole V1.

Thereafter, as shown in FIG. 16, as the solvent contained in theconductive material CM evaporates, the volume of the conductive materialCM decreases. As a result, fine particles of the metal material in theconductive material CM remain as a coat on the inner surfaces of thefirst hole V1 and the second hole V2, and hollow portion are formed inthe first hole V1 and the second hole V2. In the example illustrated,the connecting material C thus formed is in contact with the innersurface of the second hole V2, and further, in the first hole V1, is incontact with the inner surface of the concavity CC1, the inner surfaceof the hole portion VC1 and the inner surface of the hole portion VB1.

Note that in the processing step shown in FIG. 15, the conductivematerial CM may be injected to from the first hole V1, and the airbubbles BB may be emitted from the second hole V2. Further, in theprocessing step shown in FIG. 16, it suffices if the connecting materialC connects the first terminal TM1 and the second terminal TM2 to eachother by either one of the first hole V1 and the second hole V2, or maybe formed continuously in the inner surface of the first hole V1.Furthermore, the connecting material C may be formed continuously inboth of the first hole V1 and the second hole V2. In this case, thefirst hole V1 and the second hole V2 both function as holes to connectthe first terminal TM1 and the second terminal TM2 to each other.

Note that in the example shown in FIG. 14, the first hole V1 and thesecond hole V2 are formed in the same processing step. But, as will bedescribed later, after the connecting material C is formed in the firsthole V1, the connecting material C may be subjected to inspection of thecontinuity state to check a continuity error before the second hole V2is formed.

According to this embodiment, the display device DSP has the second holeV2 in addition to the first hole V1. The second hole V2 penetrates atleast one of the second basement 20 and the organic insulating layer OIso as to communicate to the first hole V1. With this structure, to formthe connecting material C, the connecting material C is injected to fromeither one of the first hole V1 and the second hole V2, and the airbubble BB is emitted from the other one. Therefore, it is possible tosuppress the decrease in the production yield of the connecting materialC, which may be caused if the air bubble BB remains therein. Thus, theoccurrence of continuity error between the first terminal TM1 and thesecond terminal TM2 can be suppressed.

Moreover, for example, if a continuity error due to insufficient fillingor hardening of the connecting material C occurs in the first hole V1,the second hole V2 is formed to reforming the connecting material C,thereby making it possible to recover the continuity error. Thus, thereliability of connection between the first terminal TM1 and the secondterminal TM2 can be improved.

Further, as compared to the example in which a wiring substrate SUB4 ismounted in the second substrate SUB2 in addition to the wiring substrateSUB3 mounted in the first substrate SUB1, this embodiment no longerrequires the terminal for mounting the wiring substrate SUB4 or therouting line for connecting the second terminal TM2 and the wiringsubstrate SUB4 to each other. Therefore, the size of the secondsubstrate SUB2 in the X-Y plane defined by the first direction X and thesecond direction Y can be reduced, and also the width of the frame inthe peripheral portion of the display device DSP can be decreased.Further, the cost for the wiring substrate SUB4, which is no longernecessary, can be reduced. Thus, the width of the frame can be reducedand a low-cost can be achieved.

Next, another example of the method of manufacturing the display deviceDSP described above will be described with reference to FIGS. 17 to 19.

FIGS. 17 to 19 illustrate a method of manufacturing the display deviceDSP shown in FIG. 1.

As shown in FIG. 17, laser beam LL1 is irradiated from above the secondsubstrate SUB2 and thus the first hole V1 is formed. Subsequently, laserbeam LL2 is irradiated from above the second substrate SUB2, and thusthe second hole V2 is formed. The laser beam LL2 is irradiated in adirection inclined with respect to the third direction Z. Thus, thesecond hole V2 is communicated to the hole portions VA1 and VB1.

Then, as shown in FIG. 18, the connecting material C is formed. First, aconductive material CM is injected to the second hole V2. Here, theconductive material CM is injected to the second hole V2 along adirection a, and an air bubble BB is emitted to the outside of the firsthole V1 along a direction b. In other words, the conductive material CMis injected to from the second hole V2, and the air bubble BB is emittedfrom the first hole V1. Note that the conductive material CM may beinjected to from the first hole V1, and the air bubble BB may be emittedfrom the second hole V2.

Thereafter, as shown in FIG. 19, the solvent contained in the conductivematerial CM is removed and the volume of the conductive material CMdecreases, thus forming a hollow portion. In the example illustrated,the connecting material C thus formed is in contact with the innersurface of the second hole V2, and further, in the first hole V1, is incontact with the inner surface of the concavity CC1, the inner surfaceof the hole portion VC1 and the inner surface of the hole portion VB1.Note that the connecting material C may be formed continuously on theinner surface of the first hole V1, or formed continuously in both ofthe first hole V1 and the second hole V2. Further, the second hole V2may be formed after checking an continuity error of the connectingmaterial C in the first hole V1.

Next, another example of the method of manufacturing the display deviceDSP described above will be described with reference to FIGS. 20 to 23.

FIGS. 20 to 23 illustrate a method of manufacturing the display deviceDSP shown in FIG. 5.

As shown in FIG. 20, laser beam LL3 is irradiated from the outer endportion OIE side towards the organic insulating layer OI and thus thesecond hole V2 is formed. The laser beam LL3 is the same as, forexample, the laser beams LL1 and LL2.

Subsequently, as shown in FIG. 21, laser beam LL1 is irradiated fromabove the second substrate SUB2, and thus the first hole V1 is formed.The laser beam LL1 is irradiated on a position overlapping the secondhole V2 along the third direction Z. Thus, the second hole V2 iscommunicated to the first hole V1.

Then, as shown in FIG. 22, the connecting material C is formed. First, aconductive material CM is injected to the first hole V1. Here, theconductive material CM is injected to the first hole V1 along adirection a, and an air bubble BB is emitted to the outside of thesecond hole V2 along a direction b. In other words, the conductivematerial CM is injected to from the first hole V1, and the air bubble BBis emitted from the second hole V2.

Thereafter, as shown in FIG. 23, the solvent contained in the conductivematerial CM is removed and the volume of the conductive material CMdecreases, thus forming a hollow portion. In the example illustrated,the connecting material C thus formed is in contact with the innersurface of the first hole V1. Note that the second hole V2 is formedinto, for example, a conical shape. Here, the diameter of a tip portionTP of the second hole V2 is formed so small to such an extent that theconnecting material C does not leak out.

Next, another example of the method of manufacturing the display deviceDSP described above will be described with reference to FIGS. 24 to 27.

FIGS. 24 to 27 illustrate a modification of the method of manufacturingthe display device DSP shown in FIG. 3.

Note that FIG. 24 shows a processing step after the first hole V1 isformed and then the connecting material C is formed in the first holeV1. In the example illustrated, the connecting material C is formed onthe inner surface of the hole portion VAL That is, the connectingmaterial C is not formed continuously between the first terminal TM1 andthe second terminal TM2 in the first hole V1. Here, when the connectingmaterial C is formed in the first hole V1, the continuity between thefirst terminal TM1 and the second terminal TM2 is inspected. Acontinuity error is detected in such a state as illustrated in thedrawing.

Then, as shown in FIG. 25, a laser beam LL2 is irradiated from above thesecond substrate SUB2, and thus the second hole V2 is formed. Thus, thefirst hole V1 and the second hole V2 can be communicated to each otherin the layer where the organic insulating layer OI is located. Here, thesecond hole V2 is formed in a place only a distance DT spaced from thefirst hole V1. In this embodiment, the distance DT is, for example,about 100 μm.

Then, as shown in FIG. 26, the connecting material C is formed. First, aconductive material CM is injected to the second hole V2. Here, theconductive material CM is injected to the second hole V2 along adirection a, and an air bubble BB is emitted to the outside of the firsthole V1 along a direction b. In other words, the conductive material CMis injected to from the second hole V2, and the air bubble BB is emittedfrom the first hole V1. Note that the conductive material CM may beinjected to from the first hole V1, and the air bubbles BB may beemitted from the second hole V2.

Thereafter, as shown in FIG. 27, the solvent contained in the conductivematerial CM is removed and the volume of the conductive material CMdecreases, thus forming a hollow portion. In the example illustrated,the connecting material C thus formed is in contact with the innersurface of the second hole V2, and also in contact with the innersurface of the concavity CC 1, the inner surface of hole portion VC1 andthe inner surface of hole portion VB1 in the first hole V1. Note thatthe connecting material C may be formed continuously with the connectingmaterial C previously formed in the first hole V1, or may be formed onlyin the first hole V1.

As described above, according to this embodiment, a display device witha frame whose width is reducible can be obtained.

While certain embodiments have been described, these embodiments havebeen presented by way of example only, and are not intended to limit thescope of the inventions. Indeed, the novel embodiments described hereinmay be embodied in a variety of other forms; furthermore, variousomissions, substitutions and changes in the form of the embodimentsdescribed herein may be made without departing from the spirit of theinventions. The accompanying claims and their equivalents are intendedto cover such forms or modifications as would fall within the scope andspirit of the inventions.

What is claimed is:
 1. A display device comprising: a first substratecomprising a first basement and a first terminal; a second substrateopposing the first substrate and comprising a second basement and asecond terminal; an organic insulating layer located between the firstbasement and the second basement; a first hole penetrating the secondbasement and the organic insulating layer; a second hole penetrating atleast one of the second basement and the organic insulating layer andcommunicating to the first hole; and a connecting material provided atleast one of the first hole and the second hole to electrically connectthe first terminal and the second terminal to each other.
 2. The deviceof claim 1, wherein a central axis of the second hole is inclined withrespect to a central axis of the first hole.
 3. The device of claim 2,wherein the first hole comprises a first hole portion penetrating thesecond basement, and the second hole penetrates from an upper surface ofthe second basement to the first hole portion.
 4. The device of claim 2,wherein the second hole penetrates the second basement and the organicinsulating layer.
 5. The device of claim 1, wherein the first holecomprises a first hole portion penetrating the second basement and asecond hole portion penetrating the organic insulating layer, the secondhole comprises a third hole portion penetrating the second basement anda fourth hole portion penetrating the organic insulating layer, and thefirst hole portion and the third hole portion are spaced apart from eachother and the second hole portion and the fourth hole portion arecommunicated to each other.
 6. The device of claim 1, furthercomprising: a detection electrode connected to the second terminal andextending along a first direction, wherein the first hole has a firstopening at a upper surface of the second substrate, the second holecomprises a second opening at the upper surface, and the first openingand the second opening are arranged along a second direction whichcrosses the first direction.
 7. The device of claim 6, wherein the firstopening and the second opening are spaced apart from each other in planview.
 8. The device of claim 6, wherein the first opening and the secondopening are partially communicated to each other in plan view.
 9. Thedevice of claim 1, wherein the second hole penetrates the organicinsulating layer between an outer end portion of the organic insulatinglayer and the first hole.
 10. An inter-substrate conducting structurecomprising: a first substrate comprising a first basement and a firstterminal; a second substrate opposing the first substrate and comprisinga second basement and a second terminal; an organic insulating layerlocated between the first basement and the second basement; a first holepenetrating the second basement and the organic insulating layer; asecond hole penetrating at least one of the second basement and theorganic insulating layer and communicating to the first hole; and aconnecting material provided at least one of the first hole and thesecond hole to electrically connect the first terminal and the secondterminal to each other.
 11. The structure of claim 10, wherein a centralaxis of the second hole is inclined with respect to a central axis ofthe first hole.
 12. The structure of claim 11, wherein the first holecomprises a first hole portion penetrating the second basement, and thesecond hole penetrates from an upper surface of the second basement tothe first hole portion.
 13. The structure of claim 11, wherein thesecond hole penetrates the second basement and the organic insulatinglayer.
 14. The structure of claim 10, wherein the first hole comprises afirst hole portion penetrating the second basement and a second holeportion penetrating the organic insulating layer, the second holecomprises a third hole portion penetrating the second basement and afourth hole portion penetrating the organic insulating layer, and thefirst hole portion and the third hole portion are spaced apart from eachother and the second hole portion and the fourth hole portion arecommunicated to each other.
 15. The structure of claim 10, furthercomprising: a detection electrode connected to the second terminal andextending along a first direction, wherein the first hole has a firstopening at the upper surface of the second substrate, the second holecomprises a second opening at the upper surface, and the first openingand the second opening are arranged along a second direction whichcrosses the first direction.
 16. The structure of claim 15, wherein thefirst opening and the second opening are spaced apart from each other inplan view.
 17. The structure of claim 15, wherein the first opening andthe second opening are partially communicated to each other in planview.
 18. The structure of claim 10, wherein the second hole penetratesthe organic insulating layer between an outer end portion of the organicinsulating layer and the first hole.